High Bandwidth ... The memory controller architecture mainly focuses on minimum communication between each of these sections which shall help user for area and performance optimization during ASIC ...

Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

The rules apply to US-made high bandwidth memory (HBM ... top-notch manufacturing expertise known as advanced packaging. “Each of those memory chips need to be ground to as thin as the height ...

Rambus recently announced the availability of its new High Bandwidth Memory ... HBM is a high-performance memory that features reduced power consumption and a small form factor. More specifically, it ...

shows that the high-bandwidth memory (HBM) chip market is set to grow from $4 billion in 2023 to $130 billion by the end of the decade, driven by the explosive growth of AI computing as workloads ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

AI required high-bandwidth memory for training large language models and inferencing quickly, and Micron has not been typically viewed as a leader in this space. However, the company recently ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the ...