SDV platforms combine high-performance computing and high-speed interfaces with support for real-time updates.

Samsung Electronics Co., Ltd. has claimed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical ...

STMicroelectronics introduces FIPS 140-3 certified trusted platform modules (TPMs) for computer, server and embedded systems.

Broadcom’s Sian2 DSP PHY delivers 200G/lane for AI data centers, enabling 800G and 1.6T optical transceivers.

Taking advantage of data-center technologies will accelerate the pace of innovation and solve the automotive industry’s ...

Congatec’s COM Express conga-TCR8 computer-on-modules feature AMD Ryzen Embedded 8000 Series processors for AI applications ...

AI noise suppression provides high-quality noise suppression in a range of audio applications while minimizing CPU load and ...

Infineon extends its CO2 sensor family with the XENSIV PAS C02 5-V sensor for higher efficiency and improved air quality in ...

Technologies such as AI chips, batteries and motors are evolving to drive further adoption of autonomous and electric ...

NXP’s Trimension SR250 combines UWB radar, secure ranging and on-chip processing in a single chip for smart homes and ...

Addressing challenges hindering EV adoption, including charging infrastructure and charging options, will be critical to ...

Infineon’s 30-V additions to its family of StrongIRFET 2 power MOSFETs deliver higher power efficiency for improved system ...