In a recent interview, with Notebookcheck, AMD's Ben Conrad made a bold claim: Strix Halo's integrated GPU offers memory ...

Even at the same resolution, you can increase the load on memory bandwidth by switching to very high-resolution textures, or ...

Silicon Valley startup d-Matrix, which is backed by Microsoft, has developed a chiplet-based solution designed for fast, ...

Researchers have developed a new type of optical memory called a programmable photonic latch that is fast and scalable, enabling temporary data storage in optical processing systems and offering a ...

Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

The different flavors of DRAM each fill a particular AI niche.

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the ...

Welcome to a new edition of Full Stack, also the last one for 2024 ... demonstrating how growth and momentum still command premium valuations if the market potential is large. While its growth is ...