Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

LAM Research's Advanced Pacakging for stacking memory on chips has more than tripled revenues in 2024 and looks even bigger ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Discover why TSMC's stock has outperformed the market due to AI-driven growth, but faces challenges from geopolitical risks.

Geek alert! Nvidia's hefty new flagship GeForce graphics card just landed with a thump at PC Labs. We're digging right in, ...

Rambus recently announced the availability of its new High Bandwidth Memory ... HBM is a high-performance memory that features reduced power consumption and a small form factor. More specifically, it ...

United Microelectronics Corporation ( NYSE: UMC) Q4 2024 Earnings Conference Call January 21, 2025 4:00 AM ET Michael Lin - Head of Investor Relations Jason Wang - President Chitung Liu - Chief ...

TSMC reported record profits for the fourth quarter of 2024, fueled by booming demand for artificial intelligence (AI) chips.

High power consumption during the functional operation implies: Higher design and manufacturing costs due to the extra effort to calibrate power grids in order to meet the power supply requirement.

The company’s Q4 revenue increased by 12%, and its operating profit rose by 15%, making for its best quarter ever, SK Hynix ...