It’s Singapore’s first facility dealing with HBM, part of the AI chips that are powering companies like Nvidia and TSMC to ...

Approximate $7 billion investment over the next several years to meet AI data center demandSINGAPORE, Jan. 08, 2025 (GLOBE ...

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Hankook Semiconductor, which holds the world's number one market share in TC bonders, began supplying Micron in April 2024, ...

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron stock surges after Nvidia CEO praises their chips at CES. But mixed technical signals may impact the rally.

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.